Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163827 | Package structure with protrusion structure | Chen-Shien Chen, Li-Huan Chu | 2018-12-25 |
| 10020239 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2018-07-10 |
| 9880220 | Edge crack detection system | Huang-Ting Hsiao, An Xu, Cheng-Hung Tsai, Tsui-Mei Chen, Nai-Cheng Lu | 2018-01-30 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen +2 more | 2018-01-02 |