Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163688 | Interconnect structure with kinked profile | Chih-Hao Chen, Hsin-Yi Tsai | 2018-12-25 |
| 10163691 | Low-K dielectric interconnect systems | Po-Cheng Shih, Chia-Cheng Chou | 2018-12-25 |
| 10141220 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2018-11-27 |
| 10062645 | Interconnect structure for semiconductor devices | Han-Hsin Kuo, Neng-Jye Yang, Fu-Ming Huang, Chi-Ming Tsai, Liang-Guang Chen | 2018-08-28 |