Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141220 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh | 2018-11-27 |
| 10134632 | Low-K dielectric layer and porogen | Joung-Wei Liou, Hui-Chun Yang, Keng-Chu Lin | 2018-11-20 |
| 9941214 | Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures | Keng-Chu Lin, Joung-Wei Liou, Kuang-Yuan Hsu | 2018-04-10 |