KL

Keng-Chu Lin

TSMC: 3 patents #702 of 2,904Top 25%
📍 Lileng, TW: #1 of 3 inventorsTop 35%
Overall (2018): #68,412 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10134632 Low-K dielectric layer and porogen Joung-Wei Liou, Hui-Chun Yang, Yu-Yun Peng 2018-11-20
9941214 Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures Yu-Yun Peng, Joung-Wei Liou, Kuang-Yuan Hsu 2018-04-10
9870944 Back-end-of-line (BEOL) interconnect structure Joung-Wei Liou 2018-01-16