Issued Patents 2018
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9910009 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2018-03-06 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Yuan-Chih Hsieh | 2018-01-23 |
| 9868628 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chia-Hua Chu | 2018-01-16 |