Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147632 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Masahito Tanabe | 2018-12-04 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Hideto Kato | 2018-11-13 |
| 10115622 | Wafer processing laminate and method for processing wafer | Michihiro Sugo, Hideto Kato | 2018-10-30 |
| 10106713 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo | 2018-10-23 |
| 9934996 | Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method | Michihiro Sugo, Hiroyuki Yasuda, Masahito Tanabe | 2018-04-03 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Masahito Tanabe, Hideto Kato | 2018-02-06 |