Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147632 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Hiroyuki Yasuda, Masahito Tanabe | 2018-12-04 |
| 10141272 | Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Hideto Kato | 2018-11-27 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Masahito Tanabe, Hiroyuki Yasuda, Shohei Tagami, Hideto Kato | 2018-11-13 |
| 10115622 | Wafer processing laminate and method for processing wafer | Shohei Tagami, Hideto Kato | 2018-10-30 |
| 10106713 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami | 2018-10-23 |
| 10074626 | Wafer laminate and making method | Hiroyuki Yasuda | 2018-09-11 |
| 9941145 | Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method | Masahito Tanabe, Hiroyuki Yasuda | 2018-04-10 |
| 9934996 | Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2018-04-03 |
| 9929068 | Film-like wafer mold material, molded wafer, and semiconductor device | Kazunori Kondo | 2018-03-27 |
| 9884979 | Temporary adhesion method and method for producing thin wafer | Hiroyuki Yasuda, Masahito Tanabe | 2018-02-06 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Masahito Tanabe, Hideto Kato | 2018-02-06 |