Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147632 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Michihiro Sugo, Hiroyuki Yasuda | 2018-12-04 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami, Hideto Kato | 2018-11-13 |
| 9941145 | Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method | Michihiro Sugo, Hiroyuki Yasuda | 2018-04-10 |
| 9934996 | Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method | Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami | 2018-04-03 |
| 9884979 | Temporary adhesion method and method for producing thin wafer | Hiroyuki Yasuda, Michihiro Sugo | 2018-02-06 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Michihiro Sugo, Hideto Kato | 2018-02-06 |