Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141272 | Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo | 2018-11-27 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami | 2018-11-13 |
| 10115622 | Wafer processing laminate and method for processing wafer | Shohei Tagami, Michihiro Sugo | 2018-10-30 |
| 10026650 | Resin composition, resin film, semiconductor device and method of manufacture thereof | Kazunori Kondo, Yoichiro Ichioka | 2018-07-17 |
| 9971242 | Photo-curable resin composition and photo-curable dry film using the same | Satoshi Asai, Kyoko Soga | 2018-05-15 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Michihiro Sugo, Masahito Tanabe | 2018-02-06 |