Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 10053556 | Barrier coating compositions, composites prepared therefrom, and quantum dot polymer composite articles including the same | Eunjoo Jang, Hyun A Kang, Nayoun Won, Oul Cho, Haeng Deog KOH | 2018-08-21 |