Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153255 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2018-12-11 |
| 10109588 | Electronic component package and package-on-package structure including the same | Sung Won Jeong, Young Gwan Ko, Myung Sam Kang | 2018-10-23 |
| 10090278 | Semiconductor packages | Sang-Sick Park, Geol Nam, Jihwan Hwang | 2018-10-02 |
| 10064291 | Circuit board and manufacturing method thereof | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2018-08-28 |
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Yeong-Hwan Choe, Tae-Joo Hwang, Young Kun Jee, Sang-Uk Han | 2018-07-10 |
| 10015877 | Circuit board comprising heat transfer structure | Myung Sam Kang, Jin Hyuk JANG, Young Gwan Ko | 2018-07-03 |
| 9992865 | Circuit board and assembly thereof | Myung Sam Kang, Young Gwan Ko, Min Jae Seong | 2018-06-05 |
| 9945911 | Apparatus and method for measuring impedance for fuel cell diagnosis | — | 2018-04-17 |
| 9899136 | Coil component and method of manufacturing the same | Sa Yong Lee, Myung Sam Kang, Seon Ha Kang, Mi Sun Hwang, Il Jong Seo | 2018-02-20 |