Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Tae-Joo Hwang, Tae Hong Min, Young Kun Jee, Sang-Uk Han | 2018-07-10 |
YC
Yeong-Hwan Choe
Overall (2018): #186,274 of 503,207Top 40%
1
Patents 2018