Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Young Kun Jee | 2018-07-10 |
| 9905550 | Semiconductor package and method of fabricating the same | Seungwon Park, Un-Byoung Kang, Taeje Cho | 2018-02-27 |