Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141286 | Methods of manufacturing semiconductor packages | Won-Il Lee, Cha-Jea Jo | 2018-11-27 |
| 10026724 | Semiconductor package and method of manufacturing the same | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2018-06-12 |
| 9893018 | Alignment mark for semiconductor device | Yeong Kwon Ko, Tae Hyeong Kim, Sun-kyoung Seo, Tae-Je Cho | 2018-02-13 |