Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134702 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Cha-Jea Jo | 2018-11-20 |
| 10008462 | Semiconductor package | Sun-kyoung Seo, Yong-Hwan Kwon, Hyung-Gil Baek, Hyun-Soo Chung, Seung-Kwan Ryu +1 more | 2018-06-26 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Dong-Hyeon Jang, Ho-Geon Song, Se-Young Jeong, Un-Byoung Kang +1 more | 2018-04-10 |
| 9929022 | Semiconductor chip package and method of manufacturing the same | Seok Hyun LEE, Yun-Seok Choi, Jin-Woo Park | 2018-03-27 |
| 9905538 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Byung-Hyug Roh | 2018-02-27 |
| 9899337 | Semiconductor package and manufacturing method thereof | Gun-ho Chang, Jong Bo Shim | 2018-02-20 |
| 9893018 | Alignment mark for semiconductor device | Yeong Kwon Ko, Tae Hyeong Kim, Ji Hwang Kim, Sun-kyoung Seo | 2018-02-13 |
| 9875918 | Initiator and method for debonding wafer supporting system | Kyu-dong Jung, Jung-Hwan Kim, Dong Gil Lee, Kwang-chul Choi | 2018-01-23 |