Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115648 | Fan-out semiconductor package and electronic device including the same | Shang Hoon Seo, Seung Yeop Kook, Ha Young Ahn, Sung Won Jeong | 2018-10-30 |
| 10109588 | Electronic component package and package-on-package structure including the same | Sung Won Jeong, Myung Sam Kang, Tae Hong Min | 2018-10-23 |
| 10102964 | Coil electronic component and manufacturing method thereof | Jin-Soo Kim, Myung Sam Kang, Kwang-Il Park, Youn-Soo Seo, Woon Chul Choi +1 more | 2018-10-16 |
| 10064291 | Circuit board and manufacturing method thereof | Tae Hong Min, Myung Sam Kang, Min Jae Seong | 2018-08-28 |
| 10062652 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Kyoung Moo Harr, Seung Yeop Kook, Ji Hoon Kim | 2018-08-28 |
| 10045444 | Printed circuit board, package and method of manufacturing the same | Jae Ean LEE, Jee-Soo Mok, Kyung Hwan Ko, Yong Ho Baek | 2018-08-07 |
| 10032697 | Electronic component package and electronic device including the same | Han Kim, Kang Heon Hur, Kyung Moon JUNG, Sung Han Kim | 2018-07-24 |
| 10026668 | Passivation layer having an opening for under bump metallurgy | Han Ul Lee, Jin Su Kim | 2018-07-17 |
| 10021785 | Printed circuit board and method of manufacturing the same | Myung Sam Kang, Sang Hoon Kim, Kang Wook Bong, Hye Won Jung, Yong Wan Ji | 2018-07-10 |
| 10015877 | Circuit board comprising heat transfer structure | Tae Hong Min, Myung Sam Kang, Jin Hyuk JANG | 2018-07-03 |
| 10002811 | Electronic component package and method of manufacturing the same | Sung Won Jeong | 2018-06-19 |
| 9999131 | Printed circuit board with embedded electronic component and manufacturing method thereof | Kyung Hwan Ko, Jae Ean LEE, Jee-Soo Mok, Yong Ho Baek | 2018-06-12 |
| 9992865 | Circuit board and assembly thereof | Tae Hong Min, Myung Sam Kang, Min Jae Seong | 2018-06-05 |
| 9984979 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Jung Ho Shim | 2018-05-29 |
| 9966178 | Chip electronic component and manufacturing method thereof | Youn-Soo Seo, Myung Sam Kang, Jin-Soo Kim, Woon Chul Choi, In Seok KIM +1 more | 2018-05-08 |