Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026668 | Passivation layer having an opening for under bump metallurgy | Jin Su Kim, Young Gwan Ko | 2018-07-17 |
HL
Han Ul Lee
Overall (2018): #404,241 of 503,207Top 85%
1
Patents 2018