Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147645 | Wafer level chip scale package with encapsulant | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2018-12-04 |
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | James R. Guajardo, Varughese Mathew, Akhilesh Kumar Singh | 2018-05-22 |
| 9953904 | Electronic component package with heatsink and multiple electronic components | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2018-04-24 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Navas Khan Oratti Kalandar, Boon Yew Low, Akhilesh Kumar Singh | 2018-04-17 |