BL

Boon Yew Low

NU Nxp Usa: 1 patents #221 of 670Top 35%
📍 Subang Jaya, MY: #1 of 4 inventorsTop 25%
Overall (2018): #473,356 of 503,207Top 95%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9947614 Packaged semiconductor device having bent leads and method for forming Navas Khan Oratti Kalandar, Nishant Lakhera, Akhilesh Kumar Singh 2018-04-17