Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147645 | Wafer level chip scale package with encapsulant | Nishant Lakhera, Akhilesh Kumar Singh | 2018-12-04 |
| 9953904 | Electronic component package with heatsink and multiple electronic components | Akhilesh Kumar Singh, Nishant Lakhera | 2018-04-24 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Nishant Lakhera, Boon Yew Low, Akhilesh Kumar Singh | 2018-04-17 |