Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147697 | Bond pad structure for semiconductor device packaging | Rama I. Hegde | 2018-12-04 |
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | Nishant Lakhera, James R. Guajardo, Akhilesh Kumar Singh | 2018-05-22 |