Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147697 | Bond pad structure for semiconductor device packaging | Varughese Mathew | 2018-12-04 |
| 10121652 | Formation of metal oxide layer | — | 2018-11-06 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147697 | Bond pad structure for semiconductor device packaging | Varughese Mathew | 2018-12-04 |
| 10121652 | Formation of metal oxide layer | — | 2018-11-06 |