Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163655 | Through substrate via liner densification | Rita J. Klein, Diem Thy N. Tran, Irina Vasilyeva, Zhiqiang Xie | 2018-12-25 |
| 9922875 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2018-03-20 |
| 9911643 | Semiconductor constructions and methods of forming intersecting lines of material | Hongqi Li, Gowrisankar Damarla, Robert J. Hanson, Shyam Ramalingam | 2018-03-06 |
| 9911653 | Low capacitance interconnect structures and associated systems and methods | Hongqi Li, Kevin J. Torek, Thy Tran, Alex J. Schrinsky | 2018-03-06 |