Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014319 | Conductive components and memory assemblies | Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, David Ross Economy, John Mark Meldrim | 2018-07-03 |
| 9922875 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Jin Lu, Shyam Ramalingam | 2018-03-20 |