Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922875 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Jin Lu | 2018-03-20 |
| 9911643 | Semiconductor constructions and methods of forming intersecting lines of material | Hongqi Li, Gowrisankar Damarla, Robert J. Hanson, Jin Lu | 2018-03-06 |