Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163655 | Through substrate via liner densification | Jin Lu, Rita J. Klein, Diem Thy N. Tran, Irina Vasilyeva | 2018-12-25 |
| 9935000 | Slit stress modulation in semiconductor substrates | James Mathew, Yunjun Ho, Hyun Sik Kim | 2018-04-03 |