Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134689 | Warpage compensation metal for wafer level packaging technology | Vivek Swaminathan Sridharan, Sriram Muthukumar | 2018-11-20 |
| 10032749 | Three-dimensional chip-to-wafer integration | Karthik Thambidurai, Viren Khandekar, Hien D. Nguyen | 2018-07-24 |