Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134689 | Warpage compensation metal for wafer level packaging technology | Amit S. Kelkar, Sriram Muthukumar | 2018-11-20 |
| 10056294 | Techniques for adhesive control between a substrate and a die | Srikanth Kulkarni, Khanh Tran | 2018-08-21 |