Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134689 | Warpage compensation metal for wafer level packaging technology | Vivek Swaminathan Sridharan, Amit S. Kelkar | 2018-11-20 |
| 10006882 | Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces | Shalini Prasad, Anjan Panneer Selvam | 2018-06-26 |