Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032749 | Three-dimensional chip-to-wafer integration | Amit S. Kelkar, Viren Khandekar, Hien D. Nguyen | 2018-07-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032749 | Three-dimensional chip-to-wafer integration | Amit S. Kelkar, Viren Khandekar, Hien D. Nguyen | 2018-07-24 |