Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109563 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2018-10-23 |
| 9953933 | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die | Aaron Cadag, Ela Mia Cadag | 2018-04-24 |