Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128169 | Package with backside protective layer during molding to prevent mold flashing failure | Ian Harvey Arellano, Ela Mia Cadag | 2018-11-13 |
| 10079198 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Ernesto Antilano, Jr., Ela Mia Cadag | 2018-09-18 |
| 9953933 | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die | Rennier Rodriguez, Ela Mia Cadag | 2018-04-24 |