Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128169 | Package with backside protective layer during molding to prevent mold flashing failure | Aaron Cadag, Ian Harvey Arellano | 2018-11-13 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2018-10-23 |
| 10079198 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ernesto Antilano, Jr. | 2018-09-18 |
| 9953933 | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die | Aaron Cadag, Rennier Rodriguez | 2018-04-24 |