Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147673 | Tapeless leadframe package with underside resin and solder contact | — | 2018-12-04 |
| 10141246 | Leadframe package with side solder ball contact and method of manufacturing | Tito Mangaoang | 2018-11-27 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2018-10-23 |
| 10008472 | Method for making semiconductor device with sidewall recess and related devices | — | 2018-06-26 |
| 9972558 | Leadframe package with side solder ball contact and method of manufacturing | Tito Mangaoang | 2018-05-15 |
| 9947636 | Method for making semiconductor device with lead frame made from top and bottom components and related devices | — | 2018-04-17 |
| 9947612 | Semiconductor device with frame having arms and related methods | Rammil Seguido | 2018-04-17 |
| 9899236 | Semiconductor package with cantilever pads | Godfrey Dimayuga | 2018-02-20 |