Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Johanna M. Swan +1 more | 2018-12-18 |
| 10083936 | Semiconductor package having spacer layer | John S. Guzek, Shan Zhong | 2018-09-25 |
| 9929119 | High density substrate routing in BBUL package | Chia-Pin Chiu | 2018-03-27 |