Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10117340 | Manufacturing method of package substrate with metal on conductive portions | Che-Wei Hsu, Pao-Hung Chou | 2018-10-30 |
| 10079220 | Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding | Chu-Chin Hu | 2018-09-18 |
| 10079190 | Methods of fabricating an electronic package structure | Chin-Wen Liu, Tang-I Wu, Shu-Wei Hu | 2018-09-18 |
| 10062649 | Package substrate | Chih-Kuai Yang | 2018-08-28 |
| 10014242 | Interposer substrate and method of fabricating the same | Pao-Hung Chou | 2018-07-03 |
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2018-06-19 |
| 9992879 | Package substrate with metal on conductive portions and manufacturing method thereof | Che-Wei Hsu, Pao-Hung Chou | 2018-06-05 |
| 9972599 | Package structure and method of manufacturing the same | Chao-Chung Tseng | 2018-05-15 |
| 9941208 | Substrate structure and manufacturing method thereof | — | 2018-04-10 |
| 9905503 | Package stucture and method of fabricating the same | Chao-Chung Tseng | 2018-02-27 |
| 9893003 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2018-02-13 |