Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2018-06-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2018-06-19 |