Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079220 | Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding | Shih-Ping Hsu | 2018-09-18 |
| 10002823 | Packaging substrate and method of fabricating the same | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2018-06-19 |