Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10117340 | Manufacturing method of package substrate with metal on conductive portions | Che-Wei Hsu, Shih-Ping Hsu | 2018-10-30 |
| 10014242 | Interposer substrate and method of fabricating the same | Shih-Ping Hsu | 2018-07-03 |
| 9992879 | Package substrate with metal on conductive portions and manufacturing method thereof | Che-Wei Hsu, Shih-Ping Hsu | 2018-06-05 |
| 9911626 | Interposer substrate and method for fabricating the same | — | 2018-03-06 |