Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar, James M. Holden | 2018-12-25 |
| 9978632 | Direct lift process apparatus | Khiem K. Nguyen, Amitabh Sabharwal | 2018-05-22 |