Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2018-12-25 |
| 10112259 | Damage isolation by shaped beam delivery in laser scribing process | Nir Merry, Todd Egan | 2018-10-30 |