Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2018-12-25 |
MY
Madhava Rao Yalamanchili
Overall (2018): #309,537 of 503,207Top 65%
1
Patents 2018