Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2018-12-25 |
| 9972575 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Brad Eaton, James S. Papanu, Ajay Kumar | 2018-05-15 |