JP

Jungrae Park

Applied Materials: 1 patents #421 of 1,019Top 45%
Overall (2018): #354,253 of 503,207Top 75%
1
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
9972575 Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar 2018-05-15