Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032643 | Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme | Jasmeet S. Chawla, Richard E. Schenker, Kanwal Jit Singh, Alan M. Myers | 2018-07-24 |
| 10032857 | Etchstop layers and capacitors | — | 2018-07-24 |
| 10026649 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri | 2018-07-17 |
| 9899255 | Via blocking layer | Rami Hourani, Marie Krysak, Florian Gstrein, Mark Bohr | 2018-02-20 |