Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098241 | Printed circuit board with edge soldering for high-density packages and assemblies | Thomas J. Brunschwiler, Andreas Doering, Stefano S. Oggioni, Joerg-Eric Sagmeister, Patricia M. Sagmeister +1 more | 2018-10-09 |
| 10050362 | Electronic circuit card with connector edge having alternated TX and RX pins assignment | Francois Abel, Andreas Doering, Mauro Spreafico, Beat Weiss | 2018-08-14 |
| 10031562 | Cooling electronic components and supplying power to the electronic components | Andreas Doering, Bruno Michel, Stephan Paredes | 2018-07-24 |
| 10008474 | Dense assembly of laterally soldered, overmolded chip packages | Thomas J. Brunschwiler, Andreas Doering, Stefano S. Oggioni, Patricia M. Sagmeister, Martin Schmatz | 2018-06-26 |