Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014213 | Selective bottom-up metal feature filling for interconnects | Kai-Hung Yu, Kandabara Tapily, Gerrit J. Leusink | 2018-07-03 |
| 9978649 | Solid source doping for source and drain extension doping | Steven P. Consiglio, Jeffrey Smith | 2018-05-22 |
| 9899224 | Method of controlling solid phase diffusion of boron dopants to form ultra-shallow doping regions | Steven P. Consiglio, David L. O'Meara | 2018-02-20 |