Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163655 | Through substrate via liner densification | Jin Lu, Diem Thy N. Tran, Irina Vasilyeva, Zhiqiang Xie | 2018-12-25 |
| 9935120 | Methods of fabricating integrated structures | John Mark Meldrim, Yushi Hu, John D. Hopkins, Hongbin Zhu, Gordon A. Haller +1 more | 2018-04-03 |