Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103450 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Cornelia K. Tsang | 2018-10-16 |
| 9953908 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Jae-Woong Nah | 2018-04-24 |
| 9872394 | Substrate via filling | Steven A. Cordes, Bing Dang, Sung Kwon Kang, Yu Luo | 2018-01-16 |