Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153219 | Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same | Hyung Jun Jeon, Byung-Iyul Park | 2018-12-11 |
| 10128148 | Methods for fabricating semiconductor devices including surface treatment processes | Viet Ha Nguyen, Thomas Oszinda, Byung-Hee Kim, Jong-Min Baek, Tae Jin Yim | 2018-11-13 |
| 10062609 | Semiconductor devices and methods of manufacturing the same | Woo Kyung You, Jong-Min Baek, Sang Shin Jang, Byung-Hee Kim, VietHa Nguyen +3 more | 2018-08-28 |
| 10008407 | Methods of manufacturing semiconductor devices including conductive structures | Woo Jin Lee, Byung-Hee Kim, Sang-Hoon Ahn, Woo Kyung You, Jong-Min Baek | 2018-06-26 |
| 9991203 | Semiconductor device and method of fabricating the same | Rak-Hwan Kim, Byung-Hee Kim, Jin-Nam Kim, Jong-Min Baek, Eun-Ji Jung | 2018-06-05 |
| 9985036 | Semiconductor device having embedded strain-inducing pattern and method of forming the same | Dong-Suk Shin, Myung-Sun Kim, Seong-Jin Nam, Pan-Kwi Park, Hoi-Sung Chung | 2018-05-29 |
| 9953924 | Semiconductor devices including a capping layer | Sangho Rha, Jongmin Baek, Wookyung You, Sanghoon Ahn | 2018-04-24 |
| 9929098 | Copper via with barrier layer and cap layer | Tae Jin Yim, Sang-Hoon Ahn, Thomas Oszinda, Jong-Min Baek, Byung-Hee Kim +1 more | 2018-03-27 |